Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

GENESIS Project to develop more sustainable processes and technologies for the semiconductor-manufacturing industry.

Softbank and Intel are developing a new large-capacity memory that will reduce power consumption compared to HBM.

GlobalFoundries to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities.

Even after three years of mass production, Samsung is said to be struggling to raise 3nm yields above 50 per cent.

Huawei has been actively developing its domestic chip supply chain and enhancing its technological capabilities and is said ...

Sarcina Technology has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO).

Mixed Signal Devices has announced its next-generation clock and timing portfolio. This new lineup introduces ...

Blighter, a developer of electronic-scanning ground movement radars, has unveiled the B422LR border surveillance system.

Hirose has launched a shielded USB Type-C connector that complies with USCAR-2 and USCAR-30 standards. The AU1 Series ...

Nisshinbo Micro Devices has announced the release of the NL8902, a high-quality dual audio operational amplifier.

Micron shipping samples of the world’s first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory.