The new 3D flash memory also ramps up density, with up to 332 memory layers, improving bit density by 59% over ...
Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM ...
Resistive RAM claims to be ideal for consolidating both code storage and data logging in a single external memory.
Companies Preview 10 th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and ...
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The oversupply of NAND flash has forced memory chipmakers to implement production cuts in response to lower-than-expected orders from PC and smartphone manufacturers. Major players in ...
SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
TOKYO -- Japanese chipmaker Kioxia Holdings has developed NAND flash memory technology with higher storage capacity and 33% faster interface speed, anticipating strong demand from artificial ...
Japanese NAND Flash manufacturer Kioxia unveiled its latest advancement in NAND flash memory technology on February 20, ...
Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Kioxia Corporation and Sandisk Corporation have pioneered a ...
Three new microcontrollers (MCUs) are joining STMicroelectronics’ STM32C0 series, giving designers more flexibility with ...
Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus fit on a GPU.
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