Lantronix Inc. has introduced the Open-Q 8550CS System-on-Module (SOM), leveraging the Qualcomm Dragonwing QCS8550 processor ...

Integrating AI into medical imaging devices enables faster, more accurate diagnoses while consuming less energy.

MemryX Inc., the maker of artificial intelligence solutions for the edge, announced Thursday that it raised $44 in a Series B ...

Google is developing a new TPU and is planning to partner with MediaTek on its 7th-generation device - due in 2026.

As the Ethernet Alliance celebrates its tenth anniversary, the consortium's roadmap spells out massive opportunities for high ...

As AI takes over attention in the tech market, the growing demand for tech center services to support increasing generative ...

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early ...

Infineon introduces OptiMOS TDM2454xx quad-phase power modules for vertical power delivery in AI data centers.

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

MediaTek announced its Genio 720 and Genio 520 AI chips at Embedded World in Nuremberg, Germany on March 11. Powered by the ...

SK hynix plans to finalize next year's supply agreement for AI-critical high-bandwidth memory chips in the first half of this year, according to chipmaker CEO Kwak Noh-jung. “This year’s HBM supply ...