Lantronix Inc. has introduced the Open-Q 8550CS System-on-Module (SOM), leveraging the Qualcomm Dragonwing QCS8550 processor ...

MemryX Inc., the maker of artificial intelligence solutions for the edge, announced Thursday that it raised $44 in a Series B ...

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

Google is developing a new TPU and is planning to partner with MediaTek on its 7th-generation device - due in 2026.

As the Ethernet Alliance celebrates its tenth anniversary, the consortium's roadmap spells out massive opportunities for high ...

Integrating AI into medical imaging devices enables faster, more accurate diagnoses while consuming less energy.

Looking at the latest shipping docs, it appears that AMD’s new Medusa Point APU might feature a chiplet-based design. Early ...

SK hynix, the world's second-largest memory chip maker, said Wednesday it unveiled a sample of its next-generation ...

Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...

Infineon introduces OptiMOS TDM2454xx quad-phase power modules for vertical power delivery in AI data centers.

Senior technical and executive management of select technology companies will have the opportunity to observe the highly ...

Chip giant Broadcom (NASDAQ: AVGO) recently posted quarterly results that have many arguing that the AI party isn’t over. The ...