Google is developing a new TPU and is planning to partner with MediaTek on its 7th-generation device - due in 2026.

Integrating AI into medical imaging devices enables faster, more accurate diagnoses while consuming less energy.

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

Infineon introduces OptiMOS TDM2454xx quad-phase power modules for vertical power delivery in AI data centers.

Columbia researchers unveil a 3D photonic-electronic chip, breaking energy barriers and enhancing bandwidth density for ...

SK hynix, the world's second-largest memory chip maker, said Wednesday it unveiled a sample of its next-generation ...

The fintech affiliate of Alibaba said its Ling-Plus-Base model can be ‘effectively trained on lower-performance devices’.

MediaTek announced its Genio 720 and Genio 520 AI chips at Embedded World in Nuremberg, Germany on March 11. Powered by the ...

Chip giant Broadcom (NASDAQ: AVGO) recently posted quarterly results that have many arguing that the AI party isn’t over. The ...

In a bold challenge to US giant Nvidia’s dominance in artificial intelligence (AI) hardware ... model on an off-the shelf industrial chip – outperforming high-end GPUs in both speed and ...