Through this collaboration, Infineon will supply high-performance bare die wafers to CDIL, which will package them into discrete and module semiconductor ... The first 'Made in India' chip is expected ...

Apple is set to introduce the ultra-thin iPhone 17 Air, and its features may be enough to convince you to buy the new model.

T he awaited Google Pixel 9a is finally here flaunting its new design with no camera bump, upgraded durability, and new ...

The Indian Space Research Organisation (ISRO) has announced the successful development of two advanced 32-bit microprocessors ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Power device makers roll out their latest advances at APEC 2025, targeting a range of applications from AI data centers to ...

When it comes to networking, the rules around here at The Next Platform are simple. When it comes to hyperscale networking ...

Not every chip ... module on the circuit board gets its signal at the right voltage and timings. This ensures everything is stable, when the clock speeds are ramped up. You may like Corsair rolls ...

A powerful and precise 3D printer with huge build volume, the K2 Plus impresses—until its filament system throws a wrench in ...

UAES rolls off first thermal management module United Automotive Electronic Systems ("UAES ... and jointly explore next-generation robotics computing platforms based on edge large models and chips, ...