Semiconductor Packaging News13d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News13d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News13d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News13d
Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...
Semiconductor Packaging News9d
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market
TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT ...
Semiconductor Packaging News13d
Nvidia Under Scrutiny: U.S. Investigates Illegal Semiconductor Exports to China Amid Trade Tensions
The U.S. Department of Commerce has urged Nvidia and distributors like Dell and Super Micro to investigate illegal semiconductor imports to China. This move highlights efforts to enforce export ...
Semiconductor Packaging News9d
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates
The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...
Semiconductor Packaging News13d
SLM Evolves Into Critical Aspect Of Chip Design And Operation
Silicon lifecycle management (SLM) has quickly advanced, transforming chip design, manufacturing & operations. Industry giants NVIDIA & Amazon leverage SLM to boost reliability & power-performance ...
Semiconductor Packaging News9d
WeEn Top Side Cooling SiC product introduction
WeEn Semiconductor introduces top-side-cooling SiC devices in TSPAK and TOLT packages, reducing thermal resistance by 17%-19%. These innovative components boost ...
Semiconductor Packaging News9d
Revolutionizing Memory: The Cutting-Edge Design Scheme Behind HBM3E's Success
SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances AI efficiency and reliability while addressing semiconductor scaling and data transmission challenges ...
Semiconductor Packaging News9d
US to probe China chips, setting up Trump for tariffs
The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import restrictions, ...
Semiconductor Packaging News10d
Moore's Law at 60: get the Intel on the next few decades
Intel's Sanjay Natarajan highlights Moore's Law's economic foundation & global influence. As physical limits loom, cutting-edge technologies like advanced packaging & Selective Layer Transfer push ...