Nvidia, TSMC and advanced packaging

Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
Semiconductor Engineering13h
Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
ASU finalizes $1 billion in CHIPS Act funding
ASU is about to get its hands on $1 billion worth of federal government funding for cutting-edge projects to advance the ...
Electronic Design1h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
ThePrint11h
US announces $1.4 billion support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...